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Microstrip >
MS Coupled Bend n (MSCBENDSn)

MS Coupled Bend n (MSCBENDSn)

Schematic symbol example MSCBENDSn (n = 20)

Properties	Description	Units	Default	Range
M	Miter ratio	none	Required	[0,1]
W	Conductor width	m	Required	>0
S	Conductor spacing	m	Required	>0
L1	Shift in reference plane 1	m	0	³ 0
L2	Shift in reference plane 2	m	0	³ 0
sub	Substrate name	none	Optional, user defined string	string
CoSimulator	Simulation engine	none	Planar EM	Planar EM
CoSimStackup	Stackup used for simulation	none	Layout Stackup	Layout Stackup, Footprint stackup, Substrate

Notes

1. This model is available for Planar EM simulation only.

2. The default reference plane is typically coincident with the opposing transmission line edge, but is extended if the miter ratio moves the outside edge of the line further out, as shown in the dimensional drawing. The reference plane is shifted even further through the use of parameters L1 and L2.

3. The maximum number of coupled bends is 20.

4. If a substrate is not defined for the component, the Layout stackup or the Footprint stackup may be used.

Netlist Form

There is no netlist form for this component; it is available for Planar EM analysis only.

Netlist Example

N/A

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