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Glossary: W
Glossary: W
Wafer Probing
The process of testing individual integrated circuits
while they still form part of a wafer. An automated tester places probes
on the device's pads, applies power to the power pads, injects a series
of signals into the input pads, and monitors the corresponding signals
returned from the output pads.
Wave Soldering
A process used to solder circuit boards populated
with through-hole components. A wave generating mechanism maintains
a wave of hot, liquid solder traveling back and forth across the surface
of a tank. The populated circuit boards are passed over the wave soldering
machine on a conveyer belt. The velocity of the conveyer belt is carefully
controlled and synchronized such that the solder wave brushes across
the bottom of the board only once.
Waveguide
A transparent path bounded by non-transparent, reflective
areas, which is fabricated directly onto the surface of a substrate.
Used in the optical interconnection strategy known as guided-wave.
W-CDMA
Wideband code-division multiple access. Typically
defined with 5 MHz channels and 3.84 MHz carrier signals.
Wire Bonding
The process of connecting the pads on an unpackaged
integrated circuit to corresponding pads on a substrate using wires
that are finer than a human hair. Wire bonding may also be used to connect
the pads on an unpackaged integrated circuit, hybrid, or multichip module
to the leads of the component package.
Wiring Layer
A layer carrying wires in a discrete wired board.
See also signal layer.
Word
A group of signals or logic functions performing a
common task and carrying or storing similar data; for example, a value
on the data bus could be referred to as a data word.
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