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Glossary: T
Glossary: T
Tap
A register output which is used to generate the next
data input to a linear feedback shift register.
Tape Automated Bonding (TAB)
A process in which transparent flexible tape has tracks
created on its surface. The pads on unpackaged integrated circuits are
attached to corresponding pads on the tape which is then stored in a
reel. Silver-loaded epoxy is screen printed on the substrate at the
site where the device is to be located and onto the pads to which the
device's leads are to be connected. The reel of TAB tape is fed through
an automatic machine which pushes the device and the TAB leads into
the epoxy. When the silver-loaded epoxy is cured using reflow soldering
or vapor-phase soldering, it forms electrical connections between the
TAB leads and the pads on the substrate.
TDM
Time-division multiplexing.
TDMA
Time-division multiple access.
Technology File
In Designer,a technology file is a collection of information,
specifiable by name at design-creation time using the Choose Layout
Technology dialog box, that specifies material stackup properties for
layout, substrates for simulation, and component libraries for design
creation. A technology (.asty) file may be saved from the current project
via the File menu. A technology file initializes a design with a set
of data to avoid repeated entry of commonly used data. This data can
consist of layers and stackup information for layout, configured libraries
of components, and substrate definition(s) for circuit analysis. Users
and foundries can customize Technology files for their own manufacturing
process and simulation models.
Tertiary Logic
An experimental technology in which logic gates are
based on three distinct voltage levels. The three voltages are used
to represent the tertiary digits 0, 1, and 2, and their logical equivalents
FALSE, TRUE, and MAYBE.
Thermal Impedance
Relates the temperature rise for a given dissipated
power (which employs an analogy to the voltage-current relationship
of impedance).
Thermal Relief Pad
A special pattern etched around a via or a plated
through-hole to connect it into a power or ground plane. A thermal relief
pad is necessary to prevent too much heat being absorbed into the power
or ground plane when the board is being soldered.
Thermal Tracking
Typically used to refer to the problems associated
with optical interconnection systems whose alignment may be disturbed
by changes in temperature.
Thevenin's theorem
Any two-terminal combination of voltage sources and
resistors is electrically equivalent to a single voltage source in series
with a single resistor.
Thick-Film Process
A process used in the manufacture of hybrids and,
to a lesser extent, multichip modules in which signal and dielectric
(insulating) layers are screen-printed onto the substrate.
Thin-Film Process
A process used in the manufacture of hybrids and multichip
modules in which signal layers and dielectric (insulating) layers are
created using opto-lithographic techniques.
Time-Of-Flight
The time taken for a signal to propagate from one
logic gate or opto-electronic component to another.
Tin-Lead Plating
An electroless plating process in which exposed areas
of copper on a circuit board are coated with a layer of tin-lead alloy.
The alloy is used to prevent the copper from oxidizing and provides
protection against contamination.
Tinning
An abbreviation of tin-lead plating, which is an electroless
plating process in which exposed areas of copper on a circuit board
are coated with a layer of tin-lead alloy. The alloy is used to prevent
the copper from oxidizing and provides protection against contamination.
Toggle
Refers to the contents or outputs of a logic function
switching to the inverse of their previous logic values.
TOI
Third-order intercept point.
Trace
A conducting connection between electronic components.
May also be called a track or a signal. In the case of integrated circuits,
such interconnections are often referred to collectively as metallization.
Tracks
A conducting connection between electronic components.
May also be called a trace or a signal. In the case of integrated circuits,
such interconnections are often referred to collectively as metallization.
Transducer
A device that converts input energy of one form into
output energy of another.
Transistor
A three-terminal semiconductor device that, in the
digital world, can be considered to operate like a switch.
Tri-State Function
A function whose output can adopt three states: 0,
1, and Z (high-impedance) The function does not drive any value in the
Z state and, in many respects, may be considered to be disconnected
from the rest of the circuit.
Truth Table
A convenient way to represent the operation of a digital
circuit as columns of input values and their corresponding output responses.
TTL (Transistor-Transistor Logic)
Logic gates implemented using particular configurations
of bipolar junction transistors.
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