|
 Ansoft Designer / Ansys Designer 在线帮助文档：
Terms in Designer >
Glossary: O
Glossary: O
Octal
Base-8 numbering system. Each octal digit can be directly
mapped onto three binary digits, or bits.
Ohm
Unit of resistance. The Greek letter omega, *, is
often used to represent ohms; for example, 1M* indicates one million
ohms.
Ohm's law
The voltage across a resistor is the product of its
resistance and the current flowing through it.
One-Hot Encoding
A form of state assignment for state machines in which
each state is represented by an individual state variable.
One-Time Programmable
A device such as a PAL, PLA, or PROM that can only
be programmed a single time and whose contents cannot be subsequently
erased.
Optical Interconnect
The generic name for interconnection strategies based
on opto-electronic systems, including fiber-optics, free-space, guided-wave,
and holographic techniques.
Optical Lithography
A process in which radiation at optical wavelengths
(usually in the ultraviolet range) is passed through a mask, and the
resulting patterns are projected onto a layer of resist coating the
substrate material.
Optical Mask
A sheet of material carrying patterns that are either
transparent or opaque to the wavelengths used in an optical-lithographic
process. Such a mask can carry hundreds of thousands of fine lines and
geometric shapes.
Opto-Electronic
Refers to a system which combines optical and electronic
components.
Organic Resist
A material which is used to coat a substrate and is
then selectively cured to form an impervious layer. These materials
are called organic because they are based on carbon compounds as are
living creatures.
Organic Solvent
A solvent for organic materials such as those used
to form organic resists.
Organic Substrate
Substrate materials such as FR4, in which woven glass
fibers are bonded together with an epoxy. These materials are called
organic because epoxies are based on carbon compounds as are living
creatures.
Overglassing
One of the final stages in the integrated circuit
fabrication process in which the entire surface of the wafer is coated
with a layer of silicon dioxide or silicon nitride. This layer may also
be referred to as the barrier layer or the passivation layer. An additional
lithographic step is required to pattern holes in this layer to allow
connections to be made to the pads.
HFSS视频教程
ADS视频教程
CST视频教程
Ansoft Designer 中文教程
|
淘宝官方店 