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   Glossary: M       


Glossary: M

 

Mask Programmable

A device such as a read-only memory which is programmed during its construction using a unique set of masks.

Maximal Displacement

A linear feedback shift register whose taps are selected such that changing a single bit in the input data stream will cause the maximum possible disruption to the register's contents.

Maximal Length

A linear feedback shift register that sequences through (2n - 1) states before returning to its original value.

Maxterm

The logical OR of the inverted variables associated with an input combination to a logical function.

MBE (Molecular Beam Epitaxy)

A technique for creating thin films on substrates in precise patterns, in which the substrate is placed in a high vacuum, and a guided beam of ionized molecules is fired at it, effectively allowing molecular-thin layers to be "painted" onto the substrate where required.

MCM (Multichip Module)

A generic name for a group of advanced interconnection and packaging technologies featuring unpackaged integrated circuits mounted directly onto a common substrate.

Medium-Scale Integration (MSI)

Refers to the number of logic gates in a device. By one convention, medium-scale integration represents a device containing 13 to 99 gates.

Meg

Unit qualifier (symbol = M) representing one million, or 106. For example, 3MHz stands for 3 x 106 Hertz.

Metallization Layer

A layer of conducting material on an integrated circuit that is selectively deposited or etched to form connections between logic gates. There may be several metallization layers separated by dielectric (insulating) layers.

Metal-Oxide Semiconductor (MOS)

A family of transistors where the controling terminal is connected to a plate that is seperated from the semiconduxtor by an insulating layer. This plate was originally made out metal (we now use polysilicon, or poly) and the insulator is an oxide -- hence the "metal-oxide" appellation.

Meta-Stable

A condition where the outputs of a logic function are oscillating uncontrollably between undefined values.

Micro

Unit qualifier (symbol = u) representing one millionth, or 10-6. For example, 3uS stands for 3 x 10-6 Seconds.

Microwave

The range in the electromagnetic spectrum from 300 MHz to 30 GHz (with corresponding wavelengths from 100 cm to 1 cm).

Microwire

A trade name for one incarnation of discrete wire technology. Microwire augments the main attributes of multiwire with laser-drilled blind vias, allowing these boards to support the maximum number of tracks and components.

Millman's method

The voltage on the ends of branches in parallel is equal to the sum of the currents flowing in every branch divided by the total equivalent conductance.

Minterm

The logical AND of the variables associated with an input combination to a logical function.

MMIC

Monolithic Microwave Integrated Circuit

Mod or Modulus

Refers to the number of states that a function such as a counter will pass through before returning to its original value. For example, a function that counts from 00002 to 11112 has a modulus of 16 and would be called a modulo-16 or mod-16 counter.

Molecular Beam Epitaxy (MBE)

A technique for creating thin films on substrates in precise patterns, in which the substrate is placed in a high vacuum, and a guided beam of ionized molecules is fired at it, effectively allowing molecular-thin layers to be "painted" onto the substrate where required.

MOS (Metal-Oxide Semiconductor)

A family of transistors where the controlling terminal is connected to a plate that is separated from the semiconductor by an insulating layer. This plate was originally made out metal (we now use polysilicon, or poly) and the insulator is an oxide -- hence the "metal-oxide" appellation.

MOSFET

Metal-oxide semiconductor field-effect transistor.

MSI (Medium-Scale Integration)

Refers to the number of logic gates in a device. By one convention, medium-scale integration represents a device containing 13 to 99 gates.

Multichip Module (MCM)

A generic name for a group of advanced interconnection and packaging technologies featuring unpackaged integrated circuits mounted directly onto a common substrate.

Multilayer

A printed circuit board constructed from a number of very thin single-sided and/or double-sided boards which are bonded together using a combination of temperature and pressure.

Multiplexer (digital)

A logic function that uses a binary value, or address, to select between a number of inputs and conveys the data from the selected input to the output.

Multiwire

A trade name for one incarnation of discrete wire technology.

Mutual Capacitance

The capacitance between two conductors (one considered aggressor, the other victim) when all other conductors are connected together and then regarded as an ignored ground. It describes the amount of coupling due to the electric field. The mutual capacitance will inject an often undesired current into the victim line proportional to the rate of change of voltage on the aggressor line. Mutual Capacitance it a cause of crosstalk.

Mutual Inductance

The inductance between two conductors (one considered aggressor, the other victim) placed close enough that the magnetic field induced by a current flowing into the aggressor line encompasses the victim. The mutual inductance will inject an often undesired voltage noise onto the victim proportional to the rate of change of the current on the aggressor line.




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