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Terms in Designer >
   Glossary: L       


Glossary: L

 

Laminate

A material constructed from thin layers or sheets. Often used in the substrate of circuit boards.

Laser Diode

A special semiconductor diode which emits a beam of coherent light.

Latch-Up Condition

A condition in which a circuit draws uncontrolled amounts of current, and certain voltages are forced, or "latched-up", to some level. Particularly relevant in the case of CMOS devices which can latch-up if their operating conditions are violated.

Lateral Thermal Conductivity

Good lateral thermal conductivity means that the heat generated by components mounted on a substrate can be conducted horizontally across the substrate and out through its leads.

Layers (and Stackup)

Layers are used in the layout editor to organize and isolate sets of geometry or other visual indicators. Signal, Metallized signal, and Dielectric are common physical layers, while Symbol (to show component symbols in layout), Error, and Ratsnest (to show connectivity) are non-physical layers. The stackup contains additional properties of the physical layers, such as material, thickness, and elevation. Geometrical information on these layers is used to generate masks for manufacturing.

LDMOS

Laterally-diffused metal oxide semiconductor.

Lead

(1)A metallic element (chemical symbol Pb). (2)A metal conductor used to provide a connection from the inside of a device package to the outside world for soldering or other mounting techniques. Leads are also commonly called pins.

Lead Frame

A metallic frame containing leads and a base to which an unpackaged integrated circuit is attached. After encapsulation, the outer part of the frame is cut away and the leads are bent into the required shapes.

Level-Sensitive

An input whose effect on a function depends only on its current logic value or level, and is not directly related to it transitioning from one logic value to another.

LFSR (Linear Feedback Shift Register)

A shift register whose data input is generated as an XOR or XNOR of two or more elements in the register chain.

Library

A library is a collection of one or more components or component dependencies (materials, symbols, footprints, or padstacks) stored in a container file. A library must be configured to a circuit before use, either by the user (manually) or by loading technology files (automatically). System libraries are provided with Designer. User libraries and Personal libraries are used to add foundry support, user defined models, and any custom set of components or simulation models. See the Library Overview topic for more information.

LIFO (Last-In First-Out)

A memory device in which data is read out in the reverse order to which it was written in.

LIFO (Last-In First Out)

A memory device in which data is read out in the reverse order to which it was written in.

Limiting Level

The input power level when the output power is goes into compression and no longer becomes linear.

Line

Used to refer to the width of a track; for example, "This track has a line-width of 0.12mm."

Linearity

Describes how closely an output signal is to a perfectly-scaled multiple of a corresponding input signal.

Load Pull

Automated measurement of RF performance of a device under test (at a constant frequency) by varying the source and load impedance presented to the device

Logic Function

A mathematical function that performs a digital operation on digital data and returns a digital value.

Logic Gate

The physical implementation of a logic function.

Logic Synthesis

A process in which a program is used to optimize the logic used to implement a design.

Low-Fired Cofired

Similar in principle to standard cofired ceramic substrate techniques. However, low-fired cofired uses modern ceramic materials with compositions that allow them to be fired at temperatures as low as 650oC to 750oC. Firing at these temperatures in an inert atmosphere such as nitrogen allows non-refractory metals such as copper to be used to create tracks.

LSI (Large-Scale Integration)

Refers to the number of logic gates in a device. By one convention, large-scale integration represents a device containing 100 to 999 gates.

LSI (Large-Scale Integration)

Refers to the number of logic gates in a device. By one convention, large-scale integration represents a device containing 100 to 999 gates.

LTH (Lead Through-Hole)

A technique for populating circuit boards in which component leads are inserted into plated through-holes. Often abbreviated to "through-hole" or "thru-hole". When all of the components have been inserted, they are soldered to the board, usually using a wave soldering technique.




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