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Glossary: A
Glossary: A
A/D (Analog-to-Digital)
The process of converting an analog value into its
digital equivalent.
ACPR
Adjacent channel power ratio.
Active Substrate
A hybrid or multichip module substrate formed from
a semiconductor. Termed active because components such as transistors
can be fabricated directly into the substrate.
Active Trimming
The process of trimming components such as resistors
while the circuit is under power. Such components are fabricated directly
onto the substrate of a hybrid or multichip module, and the trimming
is usually performed using a laser beam.
Active-High
A signal whose active state is considered to be a
logic 1.
Active-Low
A signal whose active state is considered to be a
logic 0.
Actuator
A transducer that converts an electronic signal into
a physical equivalent. For example, a loudspeaker is an actuator which
converts electronic signals into corresponding sounds.
Adaptive Hardware
Refers to devices which allow new design variations
to be "compiles" in real-time, which may be thought of as dynamically
creating subroutines in hardware (see also Virtual Hardware and Cache
Logic).
Additive Process
A process in which conducting material is added to
specific areas of a substrate. Groups of tracks, individual tracks,
or portions of tracks can be built up to precise thicknesses by iterating
the process multiple times with selective masking.
Address Bus
A unidirectional set of signals used by a computer
to point to memory locations in which it is interested.
Analog
A continuous value that most closely resembles the
real world and can be as precise as the measuring technique allows.
Analog Circuit
A collection of components used to generate or process
analog signals.
Analog-to-Digital (A/D)
The process of converting an analog value into its
digital equivalent.
Anisotropic Adhesive
Special adhesives which contain minute particles of
conductive material. These adhesives find particular application with
the flipped-chip techniques used to mount bare die on the substrates
of hybrids, multichip modules, or circuit boards. The conducting particles
are only brought in contact with each other at the sites where the raised
pads on the die are pressed down over their corresponding pads on the
substrate, thereby forming good electrical connections between the pads.
Anti-Fuse Technology
A programmable logic device technology in which conducting
paths (anti-fuses) are grown by applying signals of relatively high
voltage and current to the device's inputs.
Anti-Pad
The area of copper etched away around a via or a plated
through-hole on a power or ground plane, thereby preventing an electrical
connection being made to that plane.
Application-Specific Integrated Circuit (ASIC)
A device whose function is determined by a designer
for a particular application or group of applications.
Application-Specific Standard Part (ASSP)
Refers to an integrated circuit created by a device
manufacturer using ASIC technologies, and for these components to be
sold as standard parts to anybody who wants to buy them.
ASIC (Application-Specific Integrated Circuit)
A device whose function is determined by a designer
for a particular application or group of applications.
ASIC Cell
A logic function in the cell library defined by the
manufacturer of an application-specific integrated circuit.
Assertion-Level Logic
Special symbols which are used to more precisely indicate
the function of gates with active-low inputs.
ASSP (Application-Specific Standard Part)
Refers to an integrated circuit created by a device
manufacturer using ASIC technologies, and for these components to be
sold as standard parts to anybody who wants to buy them.
Asynchronous
A signal whose data is acknowledged or acted upon
immediately, irrespective of any clock signal.
Atlo
Unit qualifier (symbol = a) representing one millionth
of one millionth of one millionth, or 10-18. For example, 3aS stands
for 3 x 10-18 seconds.
Attenuator
A passive device used to reduce signal strength while
maintaining proper input and output impedance.
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