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BGA Package

SPICE Model Extraction Examples

General Description

This example demonstrates the extraction of a SPICE compatible network model based on the S-parameter calculation of a part of a BGA package.

The package consists of two ground balls (here build as cylinders) connected to three conductor pins. The defined electric boundaries provide the electric ground of the device.

Structure Generation

The structure is modelled in general by defining several bricks and cylinders applying extrude, translate and blend facilities. Hereby the advantage of the local coordinate system is used to determine the relative locations of the different created shapes.

Solver Setup

For solving the structure, the S-parameters simulation task "MWS S-parameter simulation" is set up in CST DESIGN STUDIO. By updating this task, all S-parameter results required for the SPICE model creation are calculated. The S-parameters are available in the navigation tree under the simulation task as well as under the corresponding block "MWSSCHEM1."

Based on these S-parameters, a SPICE compatible network model is derived by applying the MOR (Model Order Reduction) method. The extraction can be accessed via Post Processing: Signal Post Processing Network Parameters Model Order Reduction... In order to ensure an overall passivity of the model, the corresponding check button is activated in the dialog.

The resulting SPICE netlist is then imported into a CST DESIGN STUDIO simulation project "Spice netlist simulation" as a "SPICE import block" and a SPICE calculation is performed. The resulting S-Parameters can be accessed via the S-Parameters entry in the navigation tree.

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