General / Environment / Modeler
New Design Environment with a Ribbon user interface
Upgraded the CAD kernel to ACIS R23
Improved snapping by using anchor points
Transformation, Subproject import of multipin ports
Bending of shapes with a finite thickness
Enhanced Voxel import including rotate, scale, translate, multiple voxel data sets
Subproject import of Voxel models
Improved workflows for simulation project creation
Simplified simulation project creation for CST DESIGN STUDIO microstrip circuits
Simulation project creation including CST PCB STUDIO projects
Global parameters are now accessible in simulation projects
EDA Import
Update of Mentor Graphics HyperLynx import
Automatic creation of face ports/lumped elements in CST MICROWAVE STUDIO
In-plane circular face port option for BGA/Bumps
Convenient 3D system assembly of CST PCB STUDIO blocks
Improved area selection capabilities in EDA-Import
Snap-to-grid in area selection
Multiple area selection
Polygon modification options
HEX-mesh adapts to right-angle rotations of the PCB in CST MICROWAVE STUDIO
BGA/Bump diameter settings can be modified in PCB-Import dialog
Realistic 3D Bump-rendering
Import / Export
Improved CAD imports
New 3D import options
ACIS R23
PTC Creo 2.0
CATIA V5 R22
Hexahedral (Hex) Mesh
Improved speed of matrix calculation by 25% (average) for enhanced FPBA computations compared to version 2012
Reduced memory usage depending on the chosen features compared to version 2012
CST MICROWAVE STUDIO Solvers
Support of more than 2 billion mesh cells with MPI
General performance improvements
Support of remote DC Matrix calculation
Online TDR analysis
Accepted, stimulated, reflected and radiated power for each excitation of an S-Parameter port
Integral surface and volume power losses per material
Support of non-linear material models (Kerr, Raman)
Improved robustness of waveguide ports (PMC port shields, handling of coaxial ports)
Usability improvements for field source workflows (NFS export, multiple NFS import, combine results)
Normalize all results to the frequency spectrum of the excitation signal if a Gaussian is excited in the Schematic for transient co-simulation tasks
Wire meshes can be embedded in thin panel materials. This is typically used for lightning protection models.
Anisotropic thin panel material is now supported.
Waveguide ports have been enhanced to support thin panel material and octree mesh.
RCS probes can be defined for the TLM solver.
Schematic transient co-simulation tasks are supported for discrete ports in the 3D model.
Normalize all results to the frequency spectrum of the excitation signal if a Gaussian is excited in the Schematic for transient co-simulation tasks
The 2D/3D vector plotter can now be used for Field Monitors with the TLM solver
Support for multiple GPUs
Sensitivity is now available for all frequency domain solvers, including curved elements
The new port solver is now used by default for all frequency domain solvers
In addition to electric shielding for waveguides, magnetic port shielding is available
Lumped elements and ports attached to thin curved wires
Cells per wavelength and curvature order are chosen automatically with the tetrahedral (preview) mesh
A change of the solver settings no more requires deleting the tetrahedral mesh except for a few cases
Option to let port mesh and 3D mesh match
Accepted, stimulated and reflected power for each excitation of an S-Parameter port
Integral power losses per material and optionally per solid
Post processing combination of results
Fast calculation of additional results from combined and stored solutions at calculated frequencies
Improved convergence for lumped elements and discrete ports
Logarithmic sampling definitions
Improved handling of non-manifold model edges near lossy metal solids
Runs after the adaptive mesh refinement as a broadband sweep option of the general purpose solver
Single point adaptive mesh refinement at the evaluation frequency, optionally with iterative solver
Remote calculation with distributed computing
Discrete edge ports and lumped elements in parallel , thin wires
Low frequency stabilization
Constant element order from first to third
Farfield and surface current monitors
Single ended ports
The default mesh type now is tetrahedral
Sensitivity analysis with respect to materials and geometric deformations defined by face constraints
Calculation of external Q factors
Lossy and dispersive materials, evaluated at a pre-defined and fixed frequency
VBA object ”EigenmodeSolver” with access to basic results for all mesh types
Diagonal anisotropic materials
Cells per wavelength and curvature order are chosen automatically with the tetrahedral (preview) mesh
A change of the solver settings no more requires deleting the tetrahedral mesh except for a few cases
Improved visualization of rays
Visualization of points where the rays hit the structure initially
Computation of range profiles and sinograms
Symmetries are now supported for discrete ports, waveguide ports and plane wave excitations.
Simulation time reduction due to enhanced iterative solver.
New handling of layered media which enables simulation of windshield antennas etc.
Automatic edge mesh refinement is now available for finite thick conductors.
CST EM STUDIO Solvers
Improved convergence for Low Frequency Hexahedral solver
Stationary current solver with curved elements and up to 3rd order basis functions.
Nonlinear conductivity for stationary current solver (TET).
Temperature dependent conductivity for Stationary current solver (TET).
Open boundaries for Electrostatic Tetrahedral Solver.
Electro-quasistatic solver curved elements and up to 3rd order basis functions.
Open boundary conditions
Lumped elements
Fixed and floating electric boundaries
Curved elements
3rd order solution
Fixed and floating electric boundaries
Support of temperature-dependent electric conductivity
Nonlinear electric conductivity
CST PARTICLE STUDIO Solvers
Charge absorbing open boundaries for PIC
Oblique Emission and Circular Source enhancements for PIC and Tracking
ASCII export for PIC Position Monitor
Improved distributed computing for Tracking
Improved SAM support
Linux support for all solvers
New current injection scheme for the Wakefield Solver (Transmission line)
MPI support for wake integration with Indirect interfaces method
CST PCB STUDIO
Power-integrity solver:
Performance improvements
Automatic restriction of field-plot frequencies to impedance maxima
IBIS model selector
IBIS ODT (On Die Termination) modeling
Enabling/Disabling of components in Navigation Tree
Component selection for model insertion in different tasks
Assignment of SPICE subcircuits and Touchstone models to parts in Parts Library
Simplified netclass- / pin type handling
Proximity effect modeling
Improved dielectric loss modeling
Improved single via modeling
Boardcheck on Linux
CST CABLE STUDIO
Combined cable and port circuit co-simulation
Redesign of routing dialog
Models for discontinuous screens
Pin extraction from internal nodes of a cable
Proximity effect modeling
Improved dielectric loss modeling
CST MPHYSICS Solvers
Nonlinear heat capacity (modeling of phase change)
Temperature-dependent Young's Modulus
CST DESIGN STUDIO
Blocks
Extended modeling capabilities for Microstrip blocks: Support for layered substrates
New combined CST CABLE STUDIO / CST MICROWAVE STUDIO block
Support for initial conditions of capacitors/inductors
New broad side coupled microstrip block
Tasks / Results
Support for parameterized 1D result storage
More primary results for simulation results: Balances, spectra for time domain results
Selectable monitors for combine results
Improved performance for combine results
Improved performance for S-Parameter / Optimizer / Parameter sweep tasks
Support of ”Resonant: Fast S-Parameter” solver results in time domain simulations
Support of transient co-simulation with HF-TLM solver and discrete ports
Schematic
Automatic connection of bus like connections between blocks
New connection labels
Improved routing
See also